Editing: DFN-8-1EP (3x2mm)

Field: AI Skill Technical Reference

# DFN-8-1EP (3x2mm)

**Package:** DFN-8-1EP_3x2mm_P0.5mm_EP1.36x1.46mm
**Library:** Package_DFN_QFN
**Category:** IC Package
**Pads:** 9
**Pitch:** 0.5mm
**Body Size:** 3.0 x 2.0mm
**Mounting:** Surface Mount

## Description

The DFN-8-1EP is an ultra-compact 8-pin Dual Flat No-lead package measuring just 3 x 2mm. With no leads protruding from the body and a 1.36 x 1.46mm exposed thermal pad, it offers the smallest possible footprint for 8-pin ICs. Used for precision voltage references (REF3030), low-noise LDOs, temperature sensors (TMP117), and small sensor ICs. The leadless design provides excellent electrical performance with very low parasitic inductance, important for high-frequency and precision analog circuits.

## Usage Notes

- Designed for reflow soldering (paste stencil recommended)
- Pad size optimized for 0.5mm pitch components
- Follow IPC-7351 land pattern guidelines

## KiCad Library Reference

This footprint is from the official KiCad `Package_DFN_QFN` library.
Full identifier: `Package_DFN_QFN:DFN-8-1EP_3x2mm_P0.5mm_EP1.36x1.46mm`

To use in your project:
1. Open the Footprint Library Manager in KiCad
2. Search for `DFN-8-1EP_3x2mm_P0.5mm_EP1.36x1.46mm`
3. Assign to your schematic symbol in the Symbol Properties dialog

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