DFN-8-1EP (3x2mm)
Package: DFN-8-1EP_3x2mm_P0.5mm_EP1.36x1.46mm Library: Package_DFN_QFN Category: IC Package Pads: 9 Pitch: 0.5mm Body Size: 3.0 x 2.0mm Mounting: Surface Mount
Description
The DFN-8-1EP is an ultra-compact 8-pin Dual Flat No-lead package measuring just 3 x 2mm. With no leads protruding from the body and a 1.36 x 1.46mm exposed thermal pad, it offers the smallest possible footprint for 8-pin ICs. Used for precision voltage references (REF3030), low-noise LDOs, temperature sensors (TMP117), and small sensor ICs. The leadless design provides excellent electrical performance with very low parasitic inductance, important for high-frequency and precision analog circuits.
Usage Notes
- Designed for reflow soldering (paste stencil recommended)
- Pad size optimized for 0.5mm pitch components
- Follow IPC-7351 land pattern guidelines
KiCad Library Reference
This footprint is from the official KiCad Package_DFN_QFN library.
Full identifier: Package_DFN_QFN:DFN-8-1EP_3x2mm_P0.5mm_EP1.36x1.46mm
To use in your project:
- Open the Footprint Library Manager in KiCad
- Search for
DFN-8-1EP_3x2mm_P0.5mm_EP1.36x1.46mm - Assign to your schematic symbol in the Symbol Properties dialog