3D Component

TO-247-3

High-power through-hole package — IGBTs, large MOSFETs, and power modules

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Search the Adom Wiki for the 3D component "TO-247-3" (slug: 3d-to-247) at https://wiki-ufypy5dpx93o.adom.cloud/wiki/3dcomps/3d-to-247. Download the .glb and .step files from the wiki page's static assets into my current project's 3dmodels/ directory.
Category Power Package
Library Package_TO_SOT_THT
Footprint TO-247-3_Vertical
3D Model TO-247-3_Vertical.step
Format STEP
3D Model

Downloads

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AI Skill Technical Reference

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TO-247-3

Package: TO-247-3_Vertical Library: Package_TO_SOT_THT Category: Power Package 3D Model: TO-247-3_Vertical.step Format: STEP

Description

The TO-247 is the largest common through-hole power semiconductor package. With a massive metal tab and 21 x 16mm body, it dissipates up to 200W with a proper heatsink. Three leads at 5.45mm pitch carry high-current paths for IGBTs (IRG4PC50W), power MOSFETs (IRFP250N), and SiC diodes. The mounting hole accepts M3 screws for heatsink attachment. The 3D model shows the large metal backing plate, plastic body, and heavy-gauge leads.

3D Model Details

This 3D model is from the official KiCad Package_TO_SOT_THT.3dshapes library. The model is available in STEP format and can be used in any 3D CAD tool.

Formats Available

  • STEP — Industry-standard 3D CAD format, importable into Fusion 360, SolidWorks, FreeCAD
  • GLB — Web-optimized binary glTF for real-time 3D rendering

KiCad Library Reference

Footprint: Package_TO_SOT_THT:TO-247-3_Vertical 3D Model: Package_TO_SOT_THT.3dshapes/TO-247-3_Vertical.step

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0 revisions · 3D Model: Package_TO_SOT_THT.3dshapes/TO-247-3_Vertical.step · Updated 2026-03-02 17:31:36