TSSOP-20
Package: TSSOP-20_4.4x6.5mm_P0.65mm Library: Package_SO Category: IC Package Pads: 20 Pitch: 0.65mm Body Size: 4.4 x 6.5mm Mounting: Surface Mount
Description
The TSSOP-20 is a 20-pin thin shrink small outline package with 0.65mm pitch and a 4.4 x 6.5mm body. It is the natural step up from TSSOP-14 for ICs needing more I/O. Commonly houses shift registers (74HC595), I/O expanders (PCF8574), LED drivers (TLC5940), USB interfaces, and small microcontroller variants. The thin 1.1mm profile and narrow body make it suitable for dense layouts while remaining hand-solderable with drag soldering technique.
Usage Notes
- Designed for reflow soldering (paste stencil recommended)
- Pad size optimized for 0.65mm pitch components
- Follow IPC-7351 land pattern guidelines
KiCad Library Reference
This footprint is from the official KiCad Package_SO library.
Full identifier: Package_SO:TSSOP-20_4.4x6.5mm_P0.65mm
To use in your project:
- Open the Footprint Library Manager in KiCad
- Search for
TSSOP-20_4.4x6.5mm_P0.65mm - Assign to your schematic symbol in the Symbol Properties dialog