TSSOP-14
Package: TSSOP-14_4.4x5mm_P0.65mm Library: Package_SO Category: IC Package Pads: 14 Pitch: 0.65mm Body Size: 4.4 x 5.0mm Mounting: Surface Mount
Description
The TSSOP-14 (Thin Shrink Small Outline Package) is a popular 14-pin IC package with 0.65mm pitch. At 4.4 x 5mm body size, it offers significant board space savings over SOIC while remaining hand-solderable. Commonly used for op-amps (LM324, TL074), logic ICs (74HC series), motor drivers, ADCs, and small MCU peripherals. The thin profile (1.1mm max height) makes it ideal for space-constrained designs.
Usage Notes
- Designed for reflow soldering (paste stencil recommended)
- Pad size optimized for 0.65mm pitch components
- Follow IPC-7351 land pattern guidelines
KiCad Library Reference
This footprint is from the official KiCad Package_SO library.
Full identifier: Package_SO:TSSOP-14_4.4x5mm_P0.65mm
To use in your project:
- Open the Footprint Library Manager in KiCad
- Search for
TSSOP-14_4.4x5mm_P0.65mm - Assign to your schematic symbol in the Symbol Properties dialog