TO-263 (D2PAK)
Package: TO-263-2 Library: Package_TO_SOT_SMD Category: Power Package Pads: 3 Pitch: 2.54mm Body Size: 15.2 x 10.2mm Mounting: Surface Mount
Description
The TO-263 (D2PAK) is the larger sibling of the DPAK, providing even better thermal performance for high-power surface-mount applications. With a 15.2 x 10.2mm footprint and massive thermal tab, it handles up to 3W on standard PCBs and much more with thermal vias and internal copper planes. Used for high-current MOSFETs (IRFR024N), power linear regulators (LM338), and high-side switches. The D2PAK eliminates the need for heatsinks and through-hole mounting while matching TO-220 power levels in a fully SMD assembly process.
Usage Notes
- Designed for reflow soldering (paste stencil recommended)
- Pad size optimized for 2.54mm pitch components
- Follow IPC-7351 land pattern guidelines
KiCad Library Reference
This footprint is from the official KiCad Package_TO_SOT_SMD library.
Full identifier: Package_TO_SOT_SMD:TO-263-2
To use in your project:
- Open the Footprint Library Manager in KiCad
- Search for
TO-263-2 - Assign to your schematic symbol in the Symbol Properties dialog