SSOP-28
Package: SSOP-28_5.3x10.2mm_P0.65mm Library: Package_SO Category: IC Package Pads: 28 Pitch: 0.65mm Body Size: 5.3 x 10.2mm Mounting: Surface Mount
Description
The SSOP-28 is a 28-pin shrink small outline package with 0.65mm pitch and a 5.3 x 10.2mm body. It provides high pin count in a narrow form factor, making it ideal for ICs that need many I/O lines without the bulk of a QFP. Classic inhabitants include the FTDI FT232R USB-UART bridge, MCP23017 I/O expander, ADS1256 precision ADC, and various motor driver ICs. The 0.65mm pitch is still manageable with careful hand soldering and a drag-soldering technique.
Usage Notes
- Designed for reflow soldering (paste stencil recommended)
- Pad size optimized for 0.65mm pitch components
- Follow IPC-7351 land pattern guidelines
KiCad Library Reference
This footprint is from the official KiCad Package_SO library.
Full identifier: Package_SO:SSOP-28_5.3x10.2mm_P0.65mm
To use in your project:
- Open the Footprint Library Manager in KiCad
- Search for
SSOP-28_5.3x10.2mm_P0.65mm - Assign to your schematic symbol in the Symbol Properties dialog