QFN-20-1EP
Package: QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mm Library: Package_DFN_QFN Category: IC Package Pads: 21 Pitch: 0.5mm Body Size: 4.0 x 4.0mm Mounting: Surface Mount
Description
The QFN-20-1EP is a modern 20-pin Quad Flat No-lead package with an exposed thermal pad. The leadless design (4 x 4mm body, 0.5mm pitch) provides smaller footprint than equivalent leaded packages while offering superior thermal and electrical performance through the exposed pad. The 2.5 x 2.5mm thermal pad provides excellent heat dissipation. Used for sensor ICs, small microcontrollers, RF transceivers, and power management chips.
Usage Notes
- Designed for reflow soldering (paste stencil recommended)
- Pad size optimized for 0.5mm pitch components
- Follow IPC-7351 land pattern guidelines
KiCad Library Reference
This footprint is from the official KiCad Package_DFN_QFN library.
Full identifier: Package_DFN_QFN:QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mm
To use in your project:
- Open the Footprint Library Manager in KiCad
- Search for
QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mm - Assign to your schematic symbol in the Symbol Properties dialog