QFN-20
Package: QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mm Library: Package_DFN_QFN Category: IC Package 3D Model: QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mm.step Format: STEP
Description
The QFN-20 is a 20-pin leadless package with an exposed thermal pad. At 4 x 4mm with 0.5mm pitch, it provides excellent thermal performance and a small footprint — roughly half the area of an equivalent TSSOP. The exposed pad connects directly to a PCB copper pour for heat dissipation. Popular for sensor ICs, small MCUs, and RF transceivers.
3D Model Details
This 3D model is from the official KiCad Package_DFN_QFN.3dshapes library.
The model is available in STEP format and can be used in any 3D CAD tool.
Formats Available
- STEP — Industry-standard 3D CAD format, importable into Fusion 360, SolidWorks, FreeCAD
- GLB — Web-optimized binary glTF for real-time 3D rendering
KiCad Library Reference
Footprint: Package_DFN_QFN:QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mm
3D Model: Package_DFN_QFN.3dshapes/QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mm.step