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RMCF0603FT1R50 — 1.5Ω

SEI Stackpole · Thick Film Chip Resistor · General Purpose
0603 SEI Stackpole RMCF0603 RoHS Thick Film
Resistance
1.5Ω
±1%
Power Rating
100mW
1/10W @ 70°C
Tolerance
±1%
F grade
TCR
±200
ppm/°C
Max Voltage
75V
working voltage
Mouser
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Electrical Characteristics

Resistance1.5Ω ±1%
Power Rating100mW (1/10W)
Derate Above70°C → 0W at 155°C
Max Working Voltage75V
Max Overload Voltage150V
Rated Current258.2mA
TCR±200 ppm/°C
Insulation Resistance≥1GΩ @ 100V
Dielectric Withstanding100VAC

Operating Conditions

Operating Temp−55°C to +155°C
Power Derating100% to 70°C, 0% at 155°C
Solder CompatibilitySn96.5/Ag3.0/Cu0.5
Solderability Test235±5°C, 2±0.5s
Mass∼0.002g

Package & Dimensions

Top View 1.55 ± 0.15 0.80 ± 0.10 C: 0.30±0.20 Side View 0.45 ± 0.10 0603 (1608 metric) Mass: ~0.002g

Recommended Land Pattern

Pad Width (a)0.70–0.90mm
Overall Span (b)2.00–2.20mm
Pad Height (c)0.80–1.00mm
Solder Paste Thickness100–130 µm

Power Derating

Power Derating vs. Ambient Temperature (0603 — 100mW)

25% 50% 75% 100% -55°C 0°C 25°C 70°C 100°C 155°C 70°C / 100% 155°C / 0% Rated Power (%) Ambient Temperature 0%
Full rated power (100mW) up to 70°C ambient. Above 70°C, derate linearly to zero at 155°C. Formula: P = 100mW × (155 − Tamb) / 85 for T > 70°C.

Reflow Soldering Profile

Lead-Free Reflow Profile (RMCF0603 Series)

Pre-heat Peak zone 150°C 220°C 255°C 260°C limit 60–120s preheat 60–90s >220°C 0s ~50s ~170s ~220s ~260s ~360s Standard Limit
PhaseStandardLimit
Ramp Up3°C/s maxSame
Pre-heat150°C, 60–120sSame
Reflow Zone190–220°C60–90s above 220°C
Peak Temperature255°C, ≤20s260°C max
Ramp Down6°C/s maxSame

Environmental & Reliability

Short Time Overload
ΔR ≤ ±(2% + 0.1Ω)
2.5× rated voltage, 5s
Load Life
ΔR ≤ ±(3% + 0.1Ω)
1000h @ 70°C, 1.5h ON / 0.5h OFF
Solder Heat
ΔR ≤ ±1%
260±5°C, 10±0.5s
Solderability
≥95% wetting
235±5°C, 2±0.5s, Sn96.5/Ag3.0/Cu0.5
Board Flex / Bending
ΔR ≤ ±(1% + 0.05Ω)
3mm deflection, 5±1s
Rapid Temp Change
ΔR ≤ ±(1% + 0.05Ω)
−65°C / +155°C, 5 cycles

Symbol, Footprint & 3D Model

Schematic Symbol
Footprint (0603) — with solder jetting layout
3D Model (interactive)
Click & drag to rotate · Scroll to zoom
Export: KiCad Symbol (.kicad_sym) KiCad Footprint (.kicad_mod) Fusion 360 (.lbr) 3D Model (.step)

Pricing & Availability

Mouser Electronics
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PN: RMCF0603FT1R50
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DigiKey
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JLCPCB / LCSC
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Adom Basic Part — Always on hand, no shipping fee.

Documents

Datasheet SEI Stackpole RMCF Datasheet (PDF) →
SeriesRMCF0603
ManufacturerSEI Stackpole
Inventory SourceAdom Parts Inventory →
RMCF0603FT1R50 characterization · Data from SEI Stackpole datasheet (RMCF0603 series) + adom-parts-search · 2026-06-05