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CR0402-FX-1001GLF — 1kΩ

Bourns · Thick Film Chip Resistor · General Purpose
0402 Bourns CR0402 RoHS Thick Film
Resistance
1kΩ
±1%
Power Rating
62.5mW
1/16W @ 70°C
Tolerance
±1%
F grade
TCR
±100
ppm/°C
Max Voltage
50V
working voltage
Mouser
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Electrical Characteristics

Resistance1kΩ ±1%
Power Rating62.5mW (1/16W)
Derate Above70°C → 0W at 155°C
Max Working Voltage50V
Max Overload Voltage100V
Rated Current7.9mA
TCR±100 ppm/°C
Insulation Resistance≥1GΩ @ 100V
Dielectric Withstanding300V

Operating Conditions

Operating Temp−55°C to +155°C
Power Derating100% to 70°C, 0% at 155°C
Solder CompatibilitySn96.5/Ag3.0/Cu0.5
Solderability Test245±5°C, 2±0.5s
Mass∼0.001g

Package & Dimensions

Top View 1.00 ± 0.05 0.50 ± 0.05 C: 0.20±0.10 Side View 0.32 ± 0.05 0402 (1005 metric) Mass: ~0.001g

Recommended Land Pattern

Pad Width0.40mm
Pad Height0.50mm
Pad-to-Pad (Reflow)1.0mm
Solder Paste Thickness100–130 µm

Power Derating

Power Derating vs. Ambient Temperature (CR0402 — 62.5mW)

25% 50% 75% 100% -55°C 0°C 25°C 70°C 100°C 155°C 70°C / 100% 155°C / 0% Rated Power (%) Ambient Temperature 0%
Full rated power (62.5mW) up to 70°C ambient. Above 70°C, derate linearly to zero at 155°C. Formula: P = 62.5mW × (155 − Tamb) / 85 for T > 70°C.

Reflow Soldering Profile

Lead-Free Reflow Profile (Bourns CR Series)

Pre-heat Peak zone 150°C 220°C 255°C 260°C limit 60–120s preheat 60–90s >220°C 0s ~50s ~170s ~220s ~260s ~360s Standard Limit
PhaseStandardLimit
Ramp Up3°C/s maxSame
Pre-heat150°C, 60–120sSame
Reflow Zone190–220°C60–90s above 220°C
Peak Temperature255°C, ≤20s260°C max
Ramp Down6°C/s maxSame

Environmental & Reliability

Short Time Overload
ΔR ≤ ±(2% + 0.1Ω)
2.5× rated voltage, 5s
Intermittent Overload
ΔR ≤ ±(3% + 0.1Ω)
2.5× rated voltage, 10,000 cycles
Load Life
ΔR ≤ ±(3% + 0.1Ω)
1000h @ 70°C, 1.5h ON / 0.5h OFF
Load Life (Humidity)
ΔR ≤ ±(3% + 0.1Ω)
1000h @ 40±2°C, 90–95% RH
Rapid Temp Change
ΔR ≤ ±(3% + 0.1Ω)
−55°C / +155°C, 5 cycles
Solder Heat
ΔR ≤ ±(0.5% + 0.05Ω) for 1%
270±5°C, 10±1s
Solderability
≥95% wetting
245±5°C, 2±0.5s, Sn96.5/Ag3.0/Cu0.5
Board Flex / Bending
ΔR ≤ ±(2% + 0.1Ω)
3mm deflection
Dry Heat
ΔR ≤ ±(1% + 0.05Ω)
155±5°C, 96±4h

Symbol, Footprint & 3D Model

Schematic Symbol
Footprint (0402) — with solder jetting layout
3D Model (interactive)
Click & drag to rotate · Scroll to zoom
Export: KiCad Symbol (.kicad_sym) KiCad Footprint (.kicad_mod) Fusion 360 (.lbr) 3D Model (.step)

Pricing & Availability

Mouser Electronics
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PN: CR0402-FX-1001GLF
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DigiKey
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JLCPCB / LCSC
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Adom Basic Part — Always on hand, no shipping fee.

Documents

Datasheet Bourns CR Series Datasheet (PDF) →
SeriesCR0402
ManufacturerBourns
Inventory SourceAdom Parts Inventory →

Molecule — Single-Passive Board

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CR0402-FX-1001GLF characterization · Data from Bourns datasheet (CR0402 series) + adom-parts-search · 2026-06-03