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BLM15BA470SN1D — 47Ω @ 100MHz

Murata · Chip Ferrite Bead · High Speed Signal Line
0402 Murata BLM15 RoHS EMI / Signal
Impedance @ 100MHz
47Ω
±25%
Rated Current
200mA
@ 125°C ambient
DCR
0.60Ω
initial
Package
0402
1.0 × 0.5 × 0.5mm
Application
High Speed
Signal line
Mouser
$0.10
253,279 in stock

Electrical Characteristics

Impedance @ 100MHz47Ω ±25%
DC Resistance (initial)0.60Ω
DC Resistance (after test)0.65Ω
Rated Current200mA
Rated Current Condition125°C ambient
Test Frequency100 MHz ± 1 MHz
Test EquipmentKeysight 4291A

Operating Conditions

Operating Temp−55°C to +125°C
Storage Temp−55°C to +125°C
Solder CompatibilitySn-3.0Ag-0.5Cu
TypeChip Ferrite Bead
ApplicationHigh speed signal line

Package & Dimensions

Top View 1.0 ± 0.05 0.50 ± 0.05 0.25 ± 0.1 Side View 0.50 ± 0.05 0402 (1005 metric) Mass: 0.001g

Recommended Land Pattern

Pad Width (a)0.5mm
Pad-to-Pad (b) — Reflow1.2 to 1.4mm
Pad Height (c)0.5mm
Solder Paste Thickness100–120 µm

Impedance Behavior

Impedance vs. Frequency (47Ω ferrite bead — broad resistive absorption)

Resistive dominant |Z| — Impedance R — Resistance X — Reactance 0 Ω 15 Ω 30 Ω 45 Ω 60 Ω |Z| impedance 1M 10M 50M 100M 200M 500M 1G
Ferrite beads attenuate noise by converting high-frequency energy into heat. Unlike inductors, there is no sharp self-resonant peak — impedance rises broadly, peaks around 200 MHz, and rolls off. The resistive component (R) dominates in the peak region, providing broadband EMI suppression.

Reflow Soldering Profile

Standard Reflow Profile (0402 package)

Pre-heat Peak 150°C 220°C 245°C 270°C limit 90s ± 30s 30–60s >220°C 0s ~60s ~150s ~200s ~240s ~360s Standard Limit
PhaseStandardLimit
Pre-heating150–180°C, 90s ± 30sSame
HeatingAbove 220°C, 30–60sAbove 230°C, 60s max
Peak Temperature245°C ± 3°C270°C ±5°C, 10s
Soldering Heat270±5°C, 10±0.5s, Sn-3.0Ag-0.5Cu
Cycles2 times max
0402 package — smaller thermal mass means faster temperature ramp. Ensure uniform heating to avoid tombstoning.

Environmental & Reliability

Shear Test
No damage, ΔZ @ 100MHz ≤ ±30%
5N, 5s ± 1s
Bending Test
No damage, ΔZ @ 100MHz ≤ ±30%
2.0mm deflection, R340, 30s
Vibration
No damage, ΔZ @ 100MHz ≤ ±30%
10–55Hz, 1.5mm, 6h (3 dir × 2h)
Soldering Heat
No damage, ΔZ @ 100MHz ≤ ±30%
270±5°C, 10±0.5s, Sn-3.0Ag-0.5Cu
Solderability
≥95% wetting coverage
240±5°C, 3±1s
Temperature Cycle
No damage, ΔZ @ 100MHz ≤ ±30%
−55°C ↔ +125°C, 100 cycles (30min each)
Humidity
No damage, ΔZ @ 100MHz ≤ ±30%
40±2°C, 90–95% RH, 1000h
Heat Life
No damage, ΔZ @ 100MHz ≤ ±30%
125±3°C, 1000h, rated current

Symbol, Footprint & 3D Model

Schematic Symbol
Footprint (0402) — with solder jetting layout
3D Model (interactive)
Click & drag to rotate · Scroll to zoom

Pricing & Availability

DigiKey
$0.10
657,494 in stock
PN: 490-5183-2-ND
View on DigiKey →
JLCPCB / LCSC
103,656 in stock
View on LCSC →

Documents

Datasheet JENF243A_0018AQ-01 (PDF) →
Spec NumberJENF243A_0018AQ-01
ManufacturerMurata Mfg. Co., Ltd
Inventory SourceAdom Parts Inventory →

Molecule — Single-Passive Board

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BLM15BA470SN1D characterization · Data from Murata datasheet JENF243A_0018AQ-01 + adom-parts-search · 2026-06-03