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BLM15AX601SN1D — 600Ω @ 100MHz

Murata · Chip Ferrite Bead · General Use
0402 Murata BLM15 RoHS General Purpose
Impedance @ 100MHz
600Ω
±25%
Rated Current
500mA
@ 125°C ambient
DCR
0.34Ω
initial (0.39Ω post-test)
Package
0402
1.0 × 0.5 × 0.5mm
Application
General Use
General use
Mouser
$0.10
6,515 in stock

Electrical Characteristics

Impedance @ 100MHz600Ω ±25%
DC Resistance (initial)0.34Ω
DC Resistance (post-test)0.39Ω
Rated Current500mA
Rated Current Condition@ 125°C ambient
Test Frequency100 MHz ±1 MHz
Test EquipmentKeysight 4291A
TypeChip Ferrite Bead

Operating Conditions

Operating Temp−55°C to +125°C
Storage Temp−55°C to +125°C
Solder CompatibilitySn-3.0Ag-0.5Cu
Mass0.001g

Package & Dimensions

Top View 1.0 ± 0.05 0.50 ± 0.05 0.25 ± 0.1 Side View 0.50 ± 0.05 0402 (1005 metric) Mass: 0.001g

Recommended Land Pattern

Pad Width (a)0.4mm
Pad-to-Pad (b) — Reflow1.0 to 1.2mm
Pad Height (c)0.5mm
Solder Paste Thickness100–150 µm

Impedance Behavior

Impedance vs. Frequency (characteristic shape for 600Ω ferrite bead)

Resistive dominant 0 Ω 100 Ω 200 Ω 300 Ω 400 Ω 500 Ω 600 Ω 700 Ω |Z| impedance 1M 10M 50M 100M 200M 500M 1G 100 MHz spec |Z| — Impedance R — Resistance X — Reactance
Ferrite beads exhibit a broad impedance hump rather than a sharp resonance peak. The impedance is predominantly resistive near the peak, converting RF energy to heat. Rated impedance (600Ω) is specified at 100 MHz.

Reflow Soldering Profile

Standard Reflow Profile

Pre-heat Peak 150°C 220°C 245°C 270°C limit 90s ± 30s 30–60s >220°C 0s ~60s ~150s ~200s ~240s ~360s Standard Limit
PhaseStandardLimit
Pre-heating150–180°C, 90s ± 30sSame
HeatingAbove 220°C, 30–60sAbove 230°C, 60s max
Peak Temperature245°C ± 3°C270°C ±5°C, 10±0.5s
Solder AlloySn-3.0Ag-0.5Cu
Cycles2 times max

Environmental & Reliability

Shear Test
No damage, ΔZ @ 100MHz ≤ ±30%
5N, 5s ±1s
Bending Test
No damage, ΔZ @ 100MHz ≤ ±30%
2.0mm deflection, R340, 30s
Vibration
No damage, ΔZ ≤ ±30%
10–55Hz, 1.5mm, 6h (3×2h)
Soldering Heat
No damage, ΔZ @ 100MHz ≤ ±30%
270±5°C, 10±0.5s, Sn-3.0Ag-0.5Cu
Solderability
≥95% wetting coverage
240±5°C, 3±1s
Temperature Cycle
No damage, ΔZ @ 100MHz ≤ ±30%
−55°C ↔ +125°C, 100 cycles (30min ea.)
Humidity
No damage, ΔZ @ 100MHz ≤ ±30%
40±2°C, 90–95% RH, 1000h
Heat Life
No damage, ΔZ @ 100MHz ≤ ±30%
125±3°C, 1000h, rated current

Symbol, Footprint & 3D Model

Schematic Symbol
Footprint (0402) — with solder jetting layout
3D Model (interactive)
Click & drag to rotate · Scroll to zoom
Export: KiCad Symbol (.kicad_sym) KiCad Footprint (.kicad_mod) Fusion 360 (.lbr) 3D Model (.step)

Pricing & Availability

Mouser Electronics
$0.10
$0.03 @ 100 pcs
6,515 in stock · Lead: 84 days
PN: 81-BLM15AX601SN1D
View on Mouser →
DigiKey
$0.10
14,519 in stock
PN: 490-5183-2-ND
View on DigiKey →
JLCPCB / LCSC
—
3,303 in stock
Extended part
View on JLCPCB →

Documents

Datasheet JENF243A-0018AQ (PDF) →
Spec NumberJENF243A_0018AQ-01
ManufacturerMurata Mfg. Co., Ltd
Inventory SourceAdom Parts Inventory →

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BLM15AX601SN1D characterization · Data from Murata datasheet JENF243A-0018AQ + adom-parts-search · 2026-06-03