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0603N471J500CT — 470pF

Walsin Technology Corporation · Multilayer Ceramic Capacitor (MLCC) · General Purpose
0603 Walsin NP0/C0G RoHS General Purpose
Capacitance
470pF
±5% (J)
Rated Voltage
50V
DC
Dielectric
NP0
C0G
Temp Coeff
±30
ppm/°C
Insulation R
10GΩ
min @ 50V DC
Mouser
$0.10
Placeholder pricing

Electrical Characteristics

Capacitance470pF ±5% (J)
Rated Voltage50V DC
Dielectric TypeNP0 (C0G)
Dissipation FactorQ ≥ 1000 (Cap ≥ 30pF)
Insulation Resistance10GΩ or R×C ≥ 500Ω·F
Temp Coefficient±30 ppm/°C (NP0)
Test Voltage1.0 ± 0.2 Vrms
Test Frequency1.0 MHz ± 10%
Dielectric Strength250% rated (125V), 1–5s

Operating Conditions

Operating Temp−55°C to +125°C
TerminationNi/Sn (lead-free)
Solder CompatibilitySn-3.0Ag-0.5Cu
Mass~0.005g

Package & Dimensions

Top View 1.60 +0.15/−0.10 0.80 +0.15/−0.10 0.4 ± 0.2 Side View 0.80 ± 0.07 0603 (1608 metric) Mass: ~0.005g

Recommended Land Pattern

Pad Width (a)0.7mm
Pad-to-Pad (b) — Reflow1.8 to 2.0mm
Pad-to-Pad (b) — Flow2.2 to 2.6mm
Pad Height (c)0.7mm
Solder Paste Thickness100–150 µm

Impedance Behavior

Impedance vs. Frequency (characteristic shape for 470pF NP0/C0G capacitor)

SRF: ~200 MHz Capacitive Inductive Usable range (≤ SRF) 254 mΩ 1.7 Ω 11.4 Ω 76.0 Ω 507.9 Ω |Z| impedance 1M 2.8M 7.9M 22.4M 63.0M 177.5M 500.0M
Impedance reaches its minimum at the self-resonant frequency (~200 MHz). Below SRF the part behaves as a capacitor; above SRF parasitic inductance dominates. Use at ≤ ⅓ SRF (~67 MHz) for predictable capacitive behavior.

Reflow Soldering Profile

Standard Reflow Profile

Pre-heat Peak 150°C 220°C 245°C 260°C limit 90s ± 30s 30–60s >220°C 0s ~60s ~150s ~200s ~240s ~360s Standard Limit
PhaseStandardLimit
Pre-heating150–180°C, 90s ± 30sSame
HeatingAbove 220°C, 30–60sAbove 230°C, 60s max
Peak Temperature245°C ± 3°C260°C, 10s
Cycles2 times max

Environmental & Reliability

Adhesive Strength
No damage
5N (0603), 10s hold
Vibration
No damage
10–55Hz, 1.5mm amp, 2h×3 axes (6h total)
Solderability
≥95% metallized area
235 ± 5°C, 2 ± 0.5s dip
Bending Test
ΔC ≤ ±5% or 0.5pF
1mm deflection (NP0, whichever larger)
Soldering Heat
ΔC ≤ ±2.5% or 0.25pF
260 ± 5°C, 10 ± 1s dip (NP0)
Temperature Cycle
ΔC ≤ ±2.5% or 0.25pF
5 cycles, −55°C ↔ +125°C, 30min each
Insulation Resistance
10GΩ min (NP0)
50V DC, 25°C
Dielectric Strength
No damage
250% rated voltage (125V), 1–5s

Symbol, Footprint & 3D Model

Schematic Symbol
Footprint (0603) — with solder jetting layout
3D Model (interactive)
Click & drag to rotate · Scroll to zoom
Export: KiCad Symbol (.kicad_sym) KiCad Footprint (.kicad_mod) Fusion 360 (.lbr) 3D Model (.step)

Pricing & Availability

Mouser Electronics
$0.10
Placeholder pricing
PN: 0603N471J500CT
View on Mouser →
DigiKey
$0.10
Placeholder pricing
PN: 0603N471J500CT
View on DigiKey →
JLCPCB / LCSC
—
Not listed
 

Documents

Datasheet ASC_General Purpose Series, May 2026 (PDF) →
Spec NumberASC_General Purpose Series, May 2026
ManufacturerWalsin Technology Corporation
Inventory SourceAdom Parts Inventory →

Molecule — Single-Passive Board

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0603N471J500CT characterization · Data from Walsin datasheet ASC_General Purpose Series + adom-parts-search · 2026-06-03