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0402B223K250CT — 22nF

Walsin Technology Corporation · Multilayer Ceramic Capacitor (MLCC) · General Purpose
0402 Walsin X7R RoHS General Purpose
Capacitance
22nF
±10% (K)
Rated Voltage
25V
DC
Dielectric
X7R
Class II
Temp Coeff
±15%
−55 to +125°C
Insulation R
10GΩ
min @ 25V DC
Mouser
$0.10
In stock

Electrical Characteristics

Capacitance22nF ±10% (K)
Rated Voltage25V DC
Dielectric TypeX7R (Class II)
Dissipation Factor≤3.5%
Insulation Resistance10GΩ
Temp Coefficient±15% (X7R)
Test Voltage1.0 ± 0.2 Vrms
Test Frequency1.0 kHz ± 10%
Dielectric Strength250% rated (62.5V), 1–5s

Operating Conditions

Operating Temp−55°C to +125°C
Storage Temp−55°C to +125°C
TerminationNi/Sn (lead-free)
Solder CompatibilitySn-3.0Ag-0.5Cu
Mass~0.001g

Package & Dimensions

Top View 1.00 ± 0.05 0.50 ± 0.05 ~0.25 Side View 0.50 ± 0.05 0402 (1005 metric) Mass: ~0.001g

Recommended Land Pattern

Pad Width (a)0.5mm
Pad-to-Pad (b) — Reflow1.0 to 1.2mm
Pad-to-Pad (b) — Flow1.4 to 1.8mm
Pad Height (c)0.5mm
Solder Paste Thickness100–125 µm

Impedance Behavior

Impedance vs. Frequency (characteristic shape for 22nF X7R capacitor)

SRF: ~80 MHz Capacitive Inductive Usable range (≤ SRF) 67 mΩ 816 mΩ 9.9 Ω 119.5 Ω 1.4 kΩ |Z| impedance 10k 75k 565k 4M 32M 240M
Impedance reaches its minimum at the self-resonant frequency (~80 MHz). Below SRF the part behaves as a capacitor; above SRF parasitic inductance dominates. Use at ≤ ⅓ SRF (~27 MHz) for predictable capacitive behavior. X7R has higher ESR than C0G/NP0, resulting in a less sharp resonance dip.

Reflow Soldering Profile

Standard Reflow Profile

Pre-heat Peak 150°C 220°C 245°C 260°C limit 90s ± 30s 30–60s >220°C 0s ~60s ~150s ~200s ~240s ~360s Standard Limit
PhaseStandardLimit
Pre-heating150–180°C, 90s ± 30sSame
HeatingAbove 220°C, 30–60sAbove 230°C, 60s max
Peak Temperature245°C ± 3°C260°C, 10s
Cycles2 times max

Environmental & Reliability

Adhesive Strength
No damage
5N (≤0603), 10s hold
Vibration
No damage
10–55Hz, 1.5mm amp, 2h×3 axes (6h total)
Solderability
≥95% metallized area
235 ± 5°C, 2 ± 0.5s dip
Bending Test
ΔC within ±12.5%
1mm deflection (X7R)
Soldering Heat
ΔC within ±7.5%
260 ± 5°C, 10 ± 1s dip (X7R)
Temperature Cycle
ΔC within ±7.5%
5 cycles, −55°C ↔ +125°C, 30min each
Insulation Resistance
10GΩ min (X7R)
25V DC, 25°C
Dielectric Strength
No damage
250% rated voltage (62.5V), 1–5s

Symbol, Footprint & 3D Model

Schematic Symbol
Footprint (0402) — with solder jetting layout
3D Model (interactive)
Click & drag to rotate · Scroll to zoom
Export: KiCad Symbol (.kicad_sym) KiCad Footprint (.kicad_mod) Fusion 360 (.lbr) 3D Model (.step)

Pricing & Availability

Mouser Electronics
$0.10
Placeholder pricing
PN: 0402B223K250CT
Search on Mouser →
DigiKey
$0.10
Placeholder pricing
PN: 0402B223K250CT
Search on DigiKey →
JLCPCB / LCSC
$0.10
Placeholder pricing
PN: 0402B223K250CT
Search on JLCPCB →

Documents

Datasheet ASC_General Purpose Series, May 2026 (PDF) →
Spec NumberASC_General Purpose Series, May 2026
ManufacturerWalsin Technology Corporation
Inventory SourceAdom Parts Inventory →

Molecule — Single-Passive Board

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0402B223K250CT characterization · Data from Walsin datasheet ASC_General Purpose Series + adom-parts-search · 2026-06-03